Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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03/27/2007
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Application #:
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10974789
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Filing Dt:
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10/28/2004
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Publication #:
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Pub Dt:
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05/26/2005
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Inventors:
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Tetsuya Osaka, Ichiro Koiwa, Akira Hashimoto, Yoshimi Sato
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Title:
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THIN FILM CAPACITOR, HIGH-DENSITY PACKAGING SUBSTRATE INCORPORATING THIN FILM CAPACITOR, AND METHOD FOR MANUFACTURING THIN-FILM CAPACITOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 104, TOTSUKA-MACHI 1-CHOME, SHINJUKU-KU |
| TOKYO, JAPAN 169-8050 |
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| 7-12, TORANOMON 1-CHOME, MINATO-KU |
| TOKYO, JAPAN 105-8460 |
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| 150 NAKAMARUKO, NAKAHARA-KU, KAWASAKI-SHI |
| KANAGAWA, JAPAN 211-0012 |
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| WENDEROTH, LIND & PONACK, L.L.P. |
| ATTN: MATTHEW M. JACOB, ESQ. |
| 2033 K STREET, N.W. |
| SUITE 800 |
| WASHINGTON, DC 20006-1021 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 550-1 HIGASHIASAKAWA-CHO |
| HACHIOJI-SHI, TOKYO, JAPAN 193-8550 |
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| KUBOTERA & ASSOCIATES, LLC |
| 200 DAINGERFIELD ROAD, SUITE 202 |
| ALEXANDRIA, VA 22314 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 2-4-8 SHINYOKOHAMA, KOUHOKU-KU |
| YOKOHAMA, JAPAN 222-8575 |
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| RABIN & BERDO, P.C. |
| 1101 14TH ST., N.W., SUITE 500 |
| WASHINGTON, DC 20005 |
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