Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/27/2007
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Application #:
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10829060
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Filing Dt:
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04/20/2004
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Publication #:
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Pub Dt:
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05/26/2005
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Inventors:
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Su-Tsai Lu, Shu-Ming Chang, Shyh-Ming Chang, Yao-Sheng Lin, Yuan-Chang Huang
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Title:
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BONDING STRUCTURE WITH BUFFER LAYER AND METHOD OF FORMING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 195, SEC. 4 CHUNG HSING ROAD |
| HSINCHU, TAIWAN |
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| JASON Z. LIN |
| SUPREME PATENT SERVICES |
| POST OFFICE 2339 |
| SARATOGA, CA 95070 |
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