Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/24/2007
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Application #:
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10724891
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Filing Dt:
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12/02/2003
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Publication #:
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Pub Dt:
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06/02/2005
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Inventors:
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Chung-Ju Wu, Wei-Feng Lin
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Title:
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BALL GRID ARRAY PACKAGE WITH HEAT SINK DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 16, CREATION RD. 1 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN R.O.C. |
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| NATH & ASSOCIATES PLLC |
| HAROLD L. NOVICK |
| 1030 FIFTEENTH STREET, N.W., SIXTH FLOOR |
| WASHINGTON, D.C. 20005 |
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