Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10505727
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Filing Dt:
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08/25/2004
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Publication #:
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Pub Dt:
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06/02/2005
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Inventors:
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Shigeru Tanaka, Kanji Shimo-Ohsako, Takashi Itoh, Mutsuaki Murakami
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Title:
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Thermosetting resin composition and laminates and circuit board substrates made by using the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-4, NAKANOSHIMA 3-CHOME, KITA-KU |
| OSAKA-SHI, OSAKA 530-8288, JAPAN |
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| YING CHEN, ESQ. |
| HOGAN & HARTSON L.L.P. |
| 500 SOUTH GRAND AVENUE, SUITE 1900 |
| LOS ANGELES, CA 90071 |
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