Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11003680
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Filing Dt:
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12/03/2004
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Publication #:
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Pub Dt:
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06/09/2005
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Inventors:
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Rikiya Okimoto, Yoji Ueda, Tousaku Nishiyama, Satoru Tomekawa, Shozo Ochi
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Title:
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Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1006, OAZA KADOMA |
| KADOMA-SHI |
| OSAKA 571-8501, JAPAN |
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| MERCHANT & GOULD PC |
| P.O. BOX 2903 |
| MINNEAPOLIS, MN 55402-0903 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1006 OAZA KADOMA, KADOMA-SHI |
| OSAKA, JAPAN 571-8501 |
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| KENJI KAMATA |
| 1130 CONNECTICUT AVE., N.W., SUITE 1100 |
| PANASONIC PATENT CENTER |
| WASHINGTON, DC 20036 |
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