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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10976790
Filing Dt:
11/01/2004
Publication #:
Pub Dt:
06/16/2005
Inventors:
Kook-Jin Oh, Young-Han Kwon, Tae-Hyuk Kim, Suk-Chun Jung, Byung-Soo Kim, Sang-Woo Lee et al
Title:
Snap cure device for semiconductor chip attachment
Assignment: 1
Reel/Frame:
017959/0296Recorded: 06/02/2006Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/14/2006
Exec Dt:
03/22/2006
Exec Dt:
03/14/2006
Exec Dt:
03/14/2006
Exec Dt:
03/14/2006
Exec Dt:
03/14/2006
Exec Dt:
03/14/2006
Assignee:
416 MAETAN-DONG, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
HARNESS, DICKEY & PIERCE, P.L.C.
P.O. BOX 8910
RESTON, VA 20195

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