Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/27/2005
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Application #:
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10737596
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Filing Dt:
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12/15/2003
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Publication #:
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Pub Dt:
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06/16/2005
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Inventors:
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Hsieh Kun Lee, Dongyun Lee, Zhijie Zhang, Fei Huang
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Title:
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HEAT DISSIPATION ASSEMBLY WITH RESILIENT FASTENER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 66 CHUNG SHAN ROAD |
| TU-CHEN, TAIPEI HSIEN, TAIWAN |
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| FOXCONN INTERNATIONAL INC. |
| WEI TE CHUNG |
| 1650 MEMOREX DRIVE |
| SANTA CLARA, CA 95050 |
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