Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10980320
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Filing Dt:
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11/04/2004
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Publication #:
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Pub Dt:
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06/16/2005
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Inventors:
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Makoto Kubota, Tsuyoshi Sahoda, Tsutomu Nakada, Koji Mishima, Ryoichi Kimizuka
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Title:
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Plating method, plating apparatus and a method of forming fine circuit wiring
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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11-1, HANEDA ASAHI-CHO, OHTA-KU |
TOKYO 144-8510, JAPAN |
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YAMAGUCHI BLDG. 7, 19-9, TAITOH 4-CHOME |
TAITOH-KU, TOKYO 110-0016, JAPAN |
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WENDEROTH, LIND & PONACK, L.L.P. |
ATTN: MICHAEL S. HUPPERT, ESQ. |
2033 K STREET, N.W., SUITE 800 |
WASHINGTON, DC 20006-1021 |
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