Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10732015
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Filing Dt:
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12/10/2003
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Publication #:
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Pub Dt:
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06/16/2005
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Inventors:
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Evan G. Colgan, Claudis Feger, Gary F. Goth, George A. Katopis, John H. Magerlein et al
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Title:
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Local reduction of compliant thermally conductive material layer thickness on chips
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NEW ORCHARD ROAD |
ARMONK, NEW YORK 10504 |
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IBM CORP. |
FLOYD A. GONZALEZ |
INTELLECTUAL PROPERTY LAW |
2455 SOUTH ROAD, P386 |
POUGHKEEPSIE, NY 12601 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2070 ROUTE 52 |
HOPEWELL JUNCTION, NEW YORK 12533 |
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HESLIN ROTHENBERG FARLEY & MESITI P.C. |
5 COLUMBIA CIRCLE |
ALBANY, NY 12203 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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PO BOX 309 |
UGLAND HOUSE |
GRAND CAYMAN, CAYMAN ISLANDS KY1-1104 |
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HESLIN ROTHENBERG FARLEY & MESITI P.C. |
5 COLUMBIA CIRCLE |
ALBANY, NY 12203 |
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