Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10897124
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Filing Dt:
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07/23/2004
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Publication #:
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Pub Dt:
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06/16/2005
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Inventors:
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In-Young Lee, Gu-Sung Kim, Se-Young Jeong, Sun-Young Park
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Title:
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Solder bump structure for flip chip package and method for manufacturing the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416, MAETAN-DONG, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| JOHN A. CASTELLANO |
| P.O. BOX 8910 |
| RESTON, VA 20195 |
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