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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/27/2007
Application #:
10511826
Filing Dt:
10/20/2004
Publication #:
Pub Dt:
06/16/2005
Inventors:
Hiroshi Uehara, Tomohiko Kimura, Satoru Moriya, Masayoshi Yamaguchi, Hideshi Kawachi
Title:
THERMOPLASTIC RESIN COMPOSITION, POLYMER COMPOSITION, AND MOLDED PRODUCT COMPRISING THE COMPOSITION
Assignment: 1
Reel/Frame:
016352/0583Recorded: 10/20/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/06/2004
Exec Dt:
10/13/2004
Exec Dt:
10/06/2004
Exec Dt:
10/08/2004
Exec Dt:
10/08/2004
Assignee:
5-2, HIGASHI-SHIMBASHI 1-CHOME
MINATO-KU, TOKYO 105-7117, JAPAN
Correspondent:
ROBERT G. MUKAI
BUCHANAN INGERSOLL PC
(INCLUDING BURNS, DOANE, SWECKER
& MATHIS, L.L.P., POST OFFICE BOX 1404
ALEXANDRIA, VA 22313-1404

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