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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
02/13/2007
Application #:
11016890
Filing Dt:
12/21/2004
Publication #:
Pub Dt:
06/30/2005
Inventors:
Takashi Nasuno, Hiroshi Tsuda
Title:
STRUCTURE OF TEST ELEMENT GROUP WIRING AND SEMICONDUCTOR SUBSTRATE
Assignment: 1
Reel/Frame:
016120/0542Recorded: 12/21/2004Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/13/2004
Exec Dt:
12/16/2004
Assignee:
16-1 ONOGAWA
TSUKUBA-SHI, IBARAKI, JAPAN 305-8569
Correspondent:
JEFFREY A. WYAND
LEYDIG, VOIT & MAYER
700 THIRTEENTH STREET, N.W., SUITE 300
WASHINGTON, D.C. 20005-3960
Assignment: 2
Reel/Frame:
016093/0219Recorded: 06/03/2005Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/20/2005
Assignee:
21, SAIIN MIZOSAKI-CHO
UKYO-KU
KYOTO-SHI, KYOTO, JAPAN 615-8585
Correspondent:
JEFFREY A. WYAND
700 THIRTEENTH STREET, N. W.
SUITE 300
WASHINGTON, DC 20005

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