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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
09/04/2007
Application #:
11023231
Filing Dt:
12/27/2004
Publication #:
Pub Dt:
06/30/2005
Inventors:
Byong-Cheol Park, Dong-Hwa Shin, Sang-Ho Lee, Seung-Ki Chae
Title:
METHOD OF EXPOSING A WAFER TO A LIGHT, AND RETICLE, RETICLE ASSEMBLY AND EXPOSING APPARATUS FOR PERFORMING THE SAME
Assignment: 1
Reel/Frame:
016139/0214Recorded: 12/27/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/22/2004
Exec Dt:
12/22/2004
Exec Dt:
12/22/2004
Exec Dt:
12/22/2004
Assignee:
416 MAETAN-DONG, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 442-742
Correspondent:
F. CHAU & ASSOCIATES LLC
FRANK CHAU
130 WOODBURY ROAD
WOODBURY, NY 11797
Assignment: 2
Reel/Frame:
034151/0504Recorded: 11/04/2014Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/05/2014
Assignee:
10F GOLDEN TOWER BLDG.
511, SAMSEONG-RO, GANGNAM-GU
SEOUL, KOREA, REPUBLIC OF
Correspondent:
LEVENFELD PEARLSTEIN, LLC
2 N. LASALLE STREET
SUITE 1300
CHICAGO, IL 60602

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