Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
10933436
|
Filing Dt:
|
09/03/2004
|
|
Publication #:
|
|
Pub Dt:
|
06/30/2005
| | | | |
|
Inventors:
|
Tetsuro Sakano, Hiroshi Takigawa, Yuji Nishikawa, Koji Hayano, Akinori Ohyama et al
|
|
Title:
|
Cooling device for semiconductor component
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 3580, SHIBOKUSA, AZA-KOMANBA |
| OSHINO-MURA, MINAMITSURU-GUN |
| YAMANASHI, 401-0597, JAPAN |
|
|
|
|
| STAAS & HALSEY LLP |
| JOHN C. GARVEY |
| 1201 NEW YORK AVENUE, N.W., SUITE 700 |
| WASHINGTON, DC 20005 |
|
|
Search Results as of:
05/03/2024 05:10 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
