Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10748161
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Filing Dt:
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12/31/2003
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Publication #:
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Pub Dt:
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07/07/2005
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Inventors:
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Meng-Cheng Huang, Wen-Hae Tseng, Jian-Chian Kang
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Title:
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Structure of a uniform thermal conductive heat dissipation device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 12F, NO. 123-1, HSING-DE RD. |
| SANCHUNG, TAIWAN R.O.C. |
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| YI-WEN TSENG |
| 509 ROOSEVELT BLVD., #D306 |
| FALLS CHURCH, VA 22044 |
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