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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/16/2010
Application #:
11028553
Filing Dt:
01/05/2005
Publication #:
Pub Dt:
07/07/2005
Inventors:
Kyung-Lae Jang, Hee-Seok Lee
Title:
PACKAGE CIRCUIT BOARD WITH A REDUCED NUMBER OF PINS AND PACKAGE INCLUDING A PACKAGE CIRCUIT BOARD WITH A REDUCED NUMBER OF PINS AND METHODS OF MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
016166/0724Recorded: 01/05/2005Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/04/2005
Exec Dt:
01/04/2005
Assignee:
416 MAETAN-DONG, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
HARNESS, DICKEY & PIERCE, P.L.C.
P.O. BOX 8910
RESTON, VA 20195

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