Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/11/2005
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Application #:
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11059825
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Filing Dt:
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02/16/2005
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Publication #:
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Pub Dt:
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07/07/2005
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Inventors:
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Jan I. Strandberg, Richard Scott Trevino, Thomas B. Blount
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Title:
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HIGH DENSITY CHIP LEVEL PACKAGE FOR THE PACKAGING OF INTEGRATED CIRCUITS AND METHOD TO MANUFACTURE SAME
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Assignment:
1
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 2101 BLAIR MILL ROAD |
| WILLOW GROVE, PENNSYLVANIA 19090 |
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| CHRISTOPHER M. SPLETZER, SR. |
| 2101 BLAIR MILL ROAD |
| WILLOW GROVE, PA 19090 |
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