Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10502397
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Filing Dt:
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07/26/2004
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Publication #:
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Pub Dt:
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07/07/2005
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Inventors:
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Kuniyasu Shiro, Tsutomu Kobayashi, Kazuhiko Hashisaka
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Title:
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Polishing pad, platen hole cover, polishing apparatus, polishing method, and method for fabricating semiconductor device
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2-1, NIHONBASHI MUROMACHI 2-CHOME |
CHUO-KU, TOKYO 103-8666, JAPAN |
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BARRY E. BRETSCHNEIDER |
MORRISON & FOERSTER, LLP |
1650 TYSONS BLVD., SUITE 300 |
MCLEAN, VA 22102 |
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04/28/2024 01:23 PM
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