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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
12/19/2006
Application #:
11026192
Filing Dt:
12/29/2004
Publication #:
Pub Dt:
07/07/2005
Inventors:
Georg Stoeppelmann, Ornulf Rexin, Eduard Schmid, Ralph Kettl, Manfred Hewel
Title:
USE OF THERMOPLASTIC POLYAMIDE MOULDING COMPOSITIONS WITH REDUCED FORMATION OF SOLID DEPOSITS AND/OR COVERINGS
Assignment: 1
Reel/Frame:
015927/0216Recorded: 03/18/2005Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/02/2005
Exec Dt:
02/02/2005
Exec Dt:
02/02/2005
Exec Dt:
02/02/2005
Exec Dt:
02/02/2005
Assignee:
REICHENAUERSTRASSE
CH-7013 DOMAT/EMS, SWITZERLAND
Correspondent:
J.C. PATENTS
JAIWEI HUANG
4 VENTURE, SUITE 250
IRVINE, CA 92618
Assignment: 2
Reel/Frame:
016818/0051Recorded: 07/25/2005Pages: 4
Conveyance:
RECORD TO CORRECT THE FIRST INVENTOR'S NAME ON AN ASSIGNMENT PREVIOUSLY RECORDED ON REAL 015927 AND FRAME 0216.
Assignors:
Exec Dt:
02/02/2005
Exec Dt:
02/02/2005
Exec Dt:
02/02/2005
Exec Dt:
02/02/2005
Exec Dt:
02/02/2005
Assignee:
REICHENAUERSTRASSE, CH-7013
DOMAT/EMS, SWITZERLAND
Correspondent:
J.C. PATENTS
4 VENTURE, SUITE 250
IRVINE, CA 92618

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