Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10508052
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Filing Dt:
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09/17/2004
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Publication #:
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Pub Dt:
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07/14/2005
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Inventors:
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Tsuyoshi Nonaka, Masanori Ioka, Shingo Kaimori, Masato Fukagaya
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Title:
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Bonding wire and an integrated circuit device using the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1073, OAZA-EDA, SHIGARAKI-SHI |
| KOUKOA-GUN, SHIGA, JAPAN 529-1811 |
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| MCDERMOTT WILL & EMERY LLP |
| 600 13TH STREET, N.W. |
| WASHINGTON, D.C. 20005-3096 |
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Assignment:
2
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RECORD TO ADD ADD AN ASSIGNEE ON REEL 016413 FRAME 0061.
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| 1073, OAZA-EDA, SHIGARAKI-CHO |
| KOUKOA-GUN, SHIGA, 529-1811, JAPAN |
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| 10-1, FUKUURA 2-CHOME, KANAZAWA-KU |
| YOKOHAMA-SHI, KANAGAWA 236-0004, JAPAN |
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| MCDERMOTT WILL & EMERY LLP |
| 600 13TH STREET, N.W. |
| WASHINGTON, D.C. 20005-3096 |
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