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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
11002246
Filing Dt:
12/03/2004
Publication #:
Pub Dt:
07/14/2005
Inventor:
Eiichi Soda
Title:
Method for manufacturing semiconductor device
Assignment: 1
Reel/Frame:
016056/0898Recorded: 12/03/2004Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/26/2004
Assignee:
16-1 ONOGAWA
TSUKUBA-SHI
IBARAKI, JAPAN
Correspondent:
JEFFREY A. WYAND
LEYDIG, VOIT & MAYER
700 THIRTEENTH ST., N.W.
SUITE 300
WASHINGTON, D.C. 20005-3960
Assignment: 2
Reel/Frame:
016075/0892Recorded: 05/31/2005Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/27/2005
Assignee:
1753 SHIMONUMABE, NAKAHARA-KU
KAWASAKI
KANAGAWA, JAPAN 211-8668
Correspondent:
JEFFREY A. WYAND
700 THIRTEENTH STREET, N. W.
SUITE 300
WASHINGTON, DC 20005

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