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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
11023260
Filing Dt:
12/27/2004
Publication #:
Pub Dt:
07/14/2005
Inventor:
In Hyeck Baik
Title:
Methods of manufacturing semiconductor devices
Assignment: 1
Reel/Frame:
016142/0310Recorded: 12/27/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/27/2004
Assignee:
891-10 DAECHI-DONG, KANGNAM-KU
SEOUL 135-523, KOREA, REPUBLIC OF
Correspondent:
MARK C. ZIMMERMAN
HANLEY, FLIGHT & ZIMMERMAN, LLC
20 NORTH WACKER DRIVE
SUITE 4220
CHICAGO, ILLINOIS 60606
Assignment: 2
Reel/Frame:
017718/0964Recorded: 06/06/2006Pages: 21
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/10/2006
Assignee:
891-10, DAECHI-DONG, GANGNAM-GU
SEOUL, KOREA, REPUBLIC OF
Correspondent:
JEFF LLOYD
P.O. BOX 142950
GAINESVILLE, FL 32614-2950

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