Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10518030
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Filing Dt:
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12/15/2004
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Publication #:
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Pub Dt:
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07/28/2005
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Inventors:
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Toshiko Yokota, Susumu Takahashi, Hideaki Matsushima, Takuya Yamamoto, Makoto Dobashi
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Title:
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Method of forming polymide coating containing dielectric filler on surface of metallic material process for producing copper clad laminate for formation of capacitor layer for printed wiring board and copper clad laminate obtained by the process
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-11-1, OSAKI, SHINAGAWA-KU |
| TOKYO, JAPAN 141-8584 |
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| ROBERT B. MURRAY |
| ROTHWELL, FIGG, ERNST & MANBECK |
| 1425 K ST., N.W., SUITE 800 |
| WASHINGTON, D.C. 20005 |
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