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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/09/2008
Application #:
10762901
Filing Dt:
01/22/2004
Publication #:
Pub Dt:
07/28/2005
Inventor:
Joseph L. Pikulski
Title:
MICROPARTICLE LOADED SOLDER PREFORM ALLOWING BOND SITE CONTROL OF DEVICE SPACING AT MICRON, SUBMICRON, AND NANOSTRUCTURE SCALE
Assignment: 1
Reel/Frame:
014930/0865Recorded: 01/22/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/19/2004
Assignee:
3011 MALIBU CANYON ROAD
MALIBU, CALIFORNIA 90265
Correspondent:
AAGAARD & BALZAN, LLP
CHRISTOPHER R. BALZAN
674 COUNTY SQUARE DRIVE
SUITE 105
VENTURA, CA 93003

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