Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10979212
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Filing Dt:
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11/03/2004
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Publication #:
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Pub Dt:
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07/28/2005
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Inventors:
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Yoshiyuki Seike, Masahiko Amari, Ara Philipossian, Toshiro Doi, Keiji Miyachi
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Title:
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Method of conditioning polishing pad for semiconductor wafer
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5050 SHINDENBORA, ASAHIMAE-CHO |
| OWARIASAHI-SHI, AICHI, JAPAN |
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| DAVID S. SANFRAN, ESQ |
| NIXON PEABODY LLP |
| SUITE 900 |
| 401 9TH STREET N.W. |
| WASHINGTON, D.C. 2004-2128 |
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Assignment:
2
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AGREEMENT (SEE THE DOCUMENT FOR DETAILS)
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| 3-2970-53, MIHARA-CHO |
| TOKORAZAWA-SHI, SAITAMA, JAPAN |
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| 5050 SHINDENBORA, ASAHIMAE-CHO |
| OWARIASAHI-SHI, AICHI, JAPAN |
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| DAVID S. SAFRAN, ESQ. |
| NIXON PEABODY LLP |
| SUITE 900 |
| 401 9TH STREET, N.W. |
| WASHINGTON, D.C. 20004-2128 |
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