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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
05/09/2006
Application #:
10771000
Filing Dt:
02/02/2004
Publication #:
Pub Dt:
08/04/2005
Inventor:
Chandrasekharan Kothandaraman
Title:
VIA STRUCTURE FOR SEMICONDUCTOR CHIP
Assignment: 1
Reel/Frame:
014958/0792Recorded: 02/02/2004Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/29/2004
Assignee:
1730 NORTH FIRST STREET
SAN JOSE, CALIFORNIA 95112
Correspondent:
INFINEON TECHNOLOGIES NORTH AMERICA CORP
C/O SIEMENS CORPORATION
ELSA KELLER
186 WOOD AVENUE SOUTH
ISELIN, NJ 08830
Assignment: 2
Reel/Frame:
015019/0284Recorded: 08/23/2004Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/23/2004
Assignee:
ST.-MARTIN-STR. 53
MUNICH, GERMANY 81669
Correspondent:
HEATHER ROWLAND
3000 CENTREGREEN WAY
CARY, NC 27513

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