Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11045378
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Filing Dt:
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01/31/2005
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Publication #:
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Pub Dt:
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08/04/2005
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Inventor:
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Yukio Fukuzo
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Title:
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Three-dimensional semiconductor package having a connecting spacer chip formed between two semiconductor chips.
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1753 SHIMONUMABE |
| NAKAHARA-KU, KAWASAKI-SHI |
| KANAGAWA, JAPAN |
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| YOUNG & THOMPSON |
| 745 SOUTH 23RD STREET |
| 2ND FLOOR |
| ARLINGTON, VA 22202 |
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