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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10772736
Filing Dt:
02/05/2004
Publication #:
20050173799
Pub Dt:
08/11/2005
Inventors:
Juan-Jann Jou, Yu-Hua Lee, Chin-Tien Yang, Min Cao, Yuh-Da Fan, Chia-Hung Lai, Connie Hsu et al
Title:
Interconnect structure and method for its fabricating
Assignment: 1
Reel/Frame:
014969/0023Recorded: 02/05/2004Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
JOU, JUANN-JANN
Exec Dt:
01/27/2004
LEE, YU-HUA
Exec Dt:
01/27/2004
YANG, CHIN-TIEN
Exec Dt:
01/27/2004
LAI, CHIA-HUNG
Exec Dt:
01/27/2004
HSU, CONNIE
Exec Dt:
01/27/2004
LIN, MU-YI
Exec Dt:
01/27/2004
CAO, MIN
Exec Dt:
01/27/2004
KU, CHIA-YU
Exec Dt:
01/27/2004
FAN, YUH-DA
Exec Dt:
01/27/2004
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
HAYNES AND BOONE, LLP
DAVID M. O'DELL
901 MAIN STREET, SUITE 3100
DALLAS, TX 75202

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