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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11038299
Filing Dt:
01/19/2005
Publication #:
20050173809
Pub Dt:
08/11/2005
Inventors:
Yukihiro Yamamoto, Keiji Iwata, Yukio Sasaki, Kohei Tatsumi, Vivek B. Dutta, Tomofumi Jin et al
Title:
Wafer-level package and method for production thereof
Assignment: 1
Reel/Frame:
016313/0696Recorded: 04/15/2005Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
YAMAMOTO, YUKIHIRO
Exec Dt:
03/14/2005
IWATA, KEIJI
Exec Dt:
03/14/2005
SASAKI, YUKIO
Exec Dt:
03/15/2005
TATSUMI, KOHEI
Exec Dt:
03/15/2005
DUTTA, VIVEK B.
Exec Dt:
03/29/2005
JIN, TOMOFUMI
Exec Dt:
03/14/2005
NAKAMURA, KOJI
Exec Dt:
03/14/2005
INABA, SHINJI
Exec Dt:
03/10/2005
Assignee:
NIPPON STEEL CHEMICAL CO., LTD.
7-21-11, NISHI-GOTANDA, SHINAGAWA-KU
TOKYO 141-0031, JAPAN
Correspondent:
DIANE DUNN MCKAY, ESQ.
MATHEWS, COLLINS, SHEPHERD ET AL.
100 THANET CIRCLE, SUITE 306
PRINCETON, NJ 08540

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