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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
12/13/2005
Application #:
10496690
Filing Dt:
05/26/2004
Publication #:
Pub Dt:
08/11/2005
Inventors:
Naoyuki Koizumi, Kei Murayama, Takashi Kurihara, Shigeru Mizuno
Title:
Thin semiconductor chip manufacturing method
Assignment: 1
Reel/Frame:
016528/0655Recorded: 05/26/2004Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/02/2004
Exec Dt:
04/02/2004
Exec Dt:
04/02/2004
Exec Dt:
04/02/2004
Assignee:
80, OSHIMADA-MACHI
NAGANO-SHI, NAGANO, JAPAN 381-2287
Correspondent:
STAAS & HALSEY LLP
ATTENTION: H. J. STAAS
1201 NEW YORK, NY, SUITE 700
WASHINGTON, D.C. 20005
Assignment: 2
Reel/Frame:
016829/0195Recorded: 08/01/2005Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/02/2004
Exec Dt:
04/02/2004
Exec Dt:
04/02/2004
Exec Dt:
04/02/2004
Assignee:
80, OSHIMADA-MACHI
NAGANO-SHI, NAGANO 381-2287, JAPAN
Correspondent:
STAAS & HALSEY LLP
ATTENTION: H.J. STAAS
1201 NEW YORK AVE., N.W. SUITE 700
WASHINGTON, D.C. 20005

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