Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10618113
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Filing Dt:
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07/11/2003
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Publication #:
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Pub Dt:
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08/11/2005
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Inventors:
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Rajeev Joshi, Chung- Lin Wu, Sang-Do Lee, Yoon-Hwa Choi
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Title:
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Wafer-level chip scale package and method for fabricating and using the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5005 E. MCDOWELL ROAD, MD A700 |
| PHOENIX, ARIZONA 85008 |
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| SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 5005 E. MCDOWELL ROAD |
| MD A700 |
| PHOENIX, AZ 85008 |
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