skip navigationU S P T O SealUnited States Patent and Trademark Office AOTW logo
Home|Site Index|Search|Guides|Contacts|eBusiness|eBiz alerts|News|Help
Assignments on the Web > Patent Query
Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10783316
Filing Dt:
02/20/2004
Publication #:
20050186339
Pub Dt:
08/25/2005
Inventors:
Nagarajan Rajagopalan, Bok Heon Kim, Lester A. D'Cruz, Zhenjiang Cui, Girish A. Dixit et al
Title:
Methods and apparatuses promoting adhesion of dielectric barrier film to copper
Assignment: 1
Reel/Frame:
015020/0984Recorded: 02/20/2004Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
RAJAGOPALAN, NAGARAJAN
Exec Dt:
02/03/2004
KIM, BOK HEON
Exec Dt:
02/04/2004
D'CRUZ, LESTER A.
Exec Dt:
02/03/2004
CUI, ZHENJIANG
Exec Dt:
02/03/2004
DIXIT, GIRISH A.
Exec Dt:
02/05/2004
SIVARAMAKRISHNAN, VISWESWAREN
Exec Dt:
02/10/2004
M'SAAD, HICHEM
Exec Dt:
02/19/2004
SHEK, MEIYEE
Exec Dt:
02/06/2004
XIA, LI-QUN
Exec Dt:
02/10/2004
Assignee:
APPLIED MATERIALS, INC.
P.O. BOX 450A
SANTA CLARA, CALIFORNIA 95052
Correspondent:
APPLIED MATERIALS, INC.
ROBERT W. MULCAHY
LEGAL AFFAIRS DEPARTMENT
P.O. BOX 450A,M/S 2061
SANATA CLARA, CA 95052

Search Results as of: 05/10/2024 01:41 AM
If you have any comments or questions concerning the data displayed, contact PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified: August 25, 2017 v.2.6
| .HOME | INDEX| SEARCH | eBUSINESS | CONTACT US | PRIVACY STATEMENT