Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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08/28/2007
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Application #:
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11072500
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Filing Dt:
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03/07/2005
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Publication #:
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Pub Dt:
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09/15/2005
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Inventors:
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Taimei Kodaira, Sumio Utsunomiya
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Title:
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THIN FILM DEVICE SUPPLY BODY, METHOD OF FABRICATING THIN FILM DEVICE, METHOD OF TRANSFER, METHOD OF FABRICATING SEMICONDUCTOR DEVICE, AND ELECTRONIC EQUIPMENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-1, NISHI-SHINJUKU 2-CHOME |
| SHINJUKU, TOKYO, JAPAN |
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| JOSEPH M. POTENZA |
| BANNER & WITCOFF, LTD. |
| 1001 G STREET, N.W., 11TH FLOOR |
| WASHINGTON, DC 20001-4597 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 95 SAMSUNG2RO (SAN #24 NONGSEO-DONG) |
| GIHEUNG-GU, GYEONGGI-DO |
| YONGIN-CITY, KOREA, REPUBLIC OF 446-711 |
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| PATENT DEPARTMENT |
| BAKER & MCKENZIE LLP |
| 2001 ROSS AVENUE, SUITE 2300 |
| DALLAS, TX 75201 |
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Assignment:
3
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MERGER (SEE DOCUMENT FOR DETAILS).
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| (MAETAN-DONG) 129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, |
| SEOUL, KOREA, REPUBLIC OF |
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| MCDERMOTT WILL & EMERY LLP |
| 600 13TH STREET, N.W. |
| WASHINGTON, DC 20005-3096 |
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