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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
12/11/2007
Application #:
11089262
Filing Dt:
03/24/2005
Publication #:
Pub Dt:
09/29/2005
Inventors:
Osamu Kakutani, Yutaka Kondo, Yoshihiko Seino
Title:
BONDING APPARATUS
Assignment: 1
Reel/Frame:
016659/0733Recorded: 06/02/2005Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/25/2005
Exec Dt:
05/25/2005
Exec Dt:
05/15/2005
Assignee:
2-51-1, INADAIRA
MUSASHIMURAYAMA-SHI, TOKYO, JAPAN
Correspondent:
WILLIAM L. ANDROLIA
KODA & ANDROLIA
2029 CENTURY PARK EAST, SUITE 1140
LOS ANGELES, CA 90067-2983
Assignment: 2
Reel/Frame:
016659/0754Recorded: 06/06/2005Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/25/2005
Exec Dt:
05/25/2005
Exec Dt:
05/15/2005
Assignee:
2-51-1, INADAIRA
MUSASHIMURAYAMA-SHI
TOKYO, JAPAN
Correspondent:
KODA & ANDROLIA
WILLIAM L. ANDROLIA
2029 CENTURY PARK EAST
SUITE 1140
LOS ANGELES, CA 90067-2983

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