Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/20/2007
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Application #:
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10940963
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Filing Dt:
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09/15/2004
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Publication #:
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Pub Dt:
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09/29/2005
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Inventors:
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Hideki Ogawa, Hidenori Tanaka
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Title:
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IC PACKAGE, INSPECTION METHOD OF IC PACKAGE MOUNTING BODY, REPAIRING METHOD OF IC PACKAGE MOUNTING BODY, AND INSPECTION PIN FOR IC PACKAGE MOUNTING BODY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SHIBAURA 1-CHOME |
| MINATO-KU, TOKYO 105-8001, JAPAN |
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| PILLSBURY WINTHROP LLP |
| JEFFREY D. KARCESKI |
| INTELLECTUAL PROPERTY GROUP |
| P.O. BOX 10500 |
| MCLEAN, VA 22102 |
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