Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/13/2006
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Application #:
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10511189
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Filing Dt:
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04/25/2005
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Publication #:
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Pub Dt:
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10/06/2005
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Inventors:
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Hichem Abdallah, Jurgen Ohm
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Title:
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SEMICONDUCTOR COMPONENT WITH INTEGRATED CAPACITANCE STRUCTURE HAVING A PLURALITY OF METALLIZATION PLANES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ST. MARTIN, STR. 53 |
| 81669 MUNICH, GERMANY |
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| BRINKS HOFER GILSON & LIONE |
| P.O. BOX 10395 |
| CHICAGO, IL 60610 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ST. MARTIN, STR. 53, 81669 |
| MUNICH, GERMANY |
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| BRINKS HOFER GILSON & LIONE |
| P.O. BOX 10395 |
| CHICAGO, IL 60610 |
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