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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10516994
Filing Dt:
12/06/2004
Publication #:
Pub Dt:
10/06/2005
Inventors:
Yuichi Inada, Yasuyoshi Sakamoto, Katsuyuki Hiki
Title:
Mold apparatus, molded product, method of molding the same, molding machine and bush
Assignment: 1
Reel/Frame:
016695/0053Recorded: 12/06/2004Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/27/2004
Exec Dt:
10/27/2004
Exec Dt:
10/29/2004
Assignees:
9-11, KITASHINAGAWA 5-CHOME
SHINAGAWA-KU, TOKYO, JAPAN 141-8686
296-1, MATSUHIDAI
MATSUDO-SHI, CHIBA 270-2214, JAPAN
Correspondent:
SQUIRE SANDERS & DEMPSEY L.L.P.
8000 TOWERS CRESCENT DRIVE, 14TH FLOOR
TYSON CORNER, VIRGINIA 22182-2700

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