Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10957653
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Filing Dt:
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10/05/2004
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Publication #:
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Pub Dt:
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10/13/2005
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Inventors:
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Yung-Yu Hsu, Kuo-Ning Chiang, Chang-An Yuan, Chang-Chun Lee, Hsien-Chie Cheng
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Title:
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Three-dimensional multichip stack electronic package structure
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 195, SEC. 4, CHUNG HSING RD. |
| CHUNTUNG, HSINCHU, TAIWAN R.O.C. |
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| BACON & THOMAS, PLLC |
| 625 SLATERS LANE |
| FOURTH FLOOR |
| ALEXANDRIA, VA 22314 |
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