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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
7410833
Issue Dt:
08/12/2008
Application #:
10815103
Filing Dt:
03/31/2004
Publication #:
20050224966
Pub Dt:
10/13/2005
Inventors:
Keith E. Fogel, Sung K. Kang, Henry A. Nye III, Donna S. Zupanski-Nielsen et al
Title:
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS
Assignment: 1
Reel/Frame:
015691/0236Recorded: 02/08/2005Pages: 11
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
FOGEL, KEITH E.
Exec Dt:
11/12/2004
KANG, SUNG K,
Exec Dt:
11/12/2004
LAURO, PAUL A.
Exec Dt:
11/12/2004
SHIH, DA-YUAN
Exec Dt:
11/15/2004
GHOSAL, BALARAM
Exec Dt:
11/12/2004
KILPATRICK, STEPHEN
Exec Dt:
11/15/2004
NYE, HENRY A., III
Exec Dt:
11/15/2004
ZUPANSKI-NIELSEN, DONNA S.
Exec Dt:
11/12/2004
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION
ARMONK, NEW YORK 10504
Correspondent:
DAVID AKER
23 SOUTHERN ROAD
HARTSDALE, NY 10530-2128
Assignment: 2
Reel/Frame:
028959/0001Recorded: 09/13/2012Pages: 27
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
INTERNATIONAL BUSINESS MACHINES CORPORATION
Exec Dt:
07/18/2012
Assignee:
ULTRATECH, INC.
3050 ZANKER ROAD
SAN JOSE, CALIFORNIA 95134
Correspondent:
ALLSTON L. JONES
425 SHERMAN AVENUE, SUITE 230
PALO ALTO, CA 94306

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