Patent Assignment Abstract of Title
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Total Assignments:
5
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Patent #:
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Issue Dt:
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04/17/2007
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Application #:
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10825910
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Filing Dt:
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04/16/2004
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Publication #:
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Pub Dt:
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10/20/2005
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Inventors:
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Byung Tai Do, Byung Hoon Ahn
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Title:
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THERMALLY ENHANCED STACKED DIE PACKAGE AND FABRICATION METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5 YISHUN ST. 23 |
| SINGAPORE, SINGAPORE 768442 |
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| MIKIO ISHIMARU |
| THE LAW OFFICES OF MIKIO ISHIMARU |
| 1110 SUNNYVALE-SARATOGA RD., STE. A1 |
| SUNNYVALE, CA 94087 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 10 ANG MO KIO STREET 65, #04-08/09 |
| SINGAPORE, SINGAPORE 569059 |
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| MILBANK, TWEED, HADLEY & MCCLOY, LLP |
| 28 LIBERTY STREET |
| C/O LAWRENCE KASS |
| NEW YORK, NY 10005 |
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Assignment:
3
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 39TH FLOOR, CITIBANK TOWER, CITIBANK PLAZA, 3 GARDEN ROAD |
| ATTENTION: AGENCY AND TRUST |
| CENTRAL, HONG KONG |
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| LAWRENCE KASS |
| 28 LIBERTY STREET |
| C/O LAWRENCE KASS |
| NEW YORK, NY 10005 |
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Assignment:
4
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 5 YISHUN STREET 23 |
| SINGAP[ORE, SINGAPORE |
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| EDWARD J. MAYLE |
| 1850 K STREET, N.W. |
| SUITE 1100 |
| WASHINGTON, DE 20006 |
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Assignment:
5
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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| 46429 LANDING PARKWAY |
| FREMONT, CALIFORNIA 94538 |
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| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE 768442 |
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| PATENT LAW GROUP: ATKINS AND ASSOCIATES |
| 123 W. CHANDLER HEIGHTS ROAD, #12535 |
| CHANDLER, AZ 85248 |
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