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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10525007
Filing Dt:
02/17/2005
Publication #:
Pub Dt:
10/20/2005
Inventor:
Kazuhisa Arai
Title:
Method for fabricating semiconductor wafer
Assignment: 1
Reel/Frame:
016748/0771Recorded: 02/17/2005Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/04/2005
Assignee:
13-11, OMORI-KITA 2-CHOME
OTA-KU
TOKYO, JAPAN 143-8580
Correspondent:
WENDEROTH, LIND & PONACK, L.L.P.
ATTN: CHARLES R. WATTS, ESQ.
2033 K STREET, NW, SUITE 800
WASHINGTON, D.C. 20006-1021

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