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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/13/2009
Application #:
11108908
Filing Dt:
04/19/2005
Publication #:
Pub Dt:
10/20/2005
Inventors:
Chikage Noritake, Yoshitsugu Sakamoto, Akira Tanahashi, Hideki Okada, Tomomasa Yoshida
Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING SOLDER LAYER
Assignment: 1
Reel/Frame:
016615/0776Recorded: 05/26/2005Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/02/2005
Exec Dt:
04/01/2005
Exec Dt:
04/01/2005
Exec Dt:
04/18/2005
Exec Dt:
04/18/2005
Assignees:
1-1, SHOWA-CHO,
KARIYA-CITY, AICHI-PREF., 448-8661, JAPAN
1, TOYOTA-CHO, TOYOTA-CITY
AICHI-PREF., 471-8571, JAPAN
Correspondent:
DAVID G. POSZ
POSZ LAW GROUP, PLC
12040 SOUTH LAKES DRIVE, SUITE 101
RESTON, VA 20191

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