Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10842959
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Filing Dt:
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05/10/2004
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Publication #:
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Pub Dt:
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11/10/2005
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Inventors:
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Wen Kun Yang, Wen Ping Yang, Shih Li Chen
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Title:
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Manufacturing tool for wafer level package and method of placing dies
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 65, GUANGFU N. RD. |
HUKOU TOWNSHIP 303, TAIWAN ROC |
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PERKINS COIE, LLP |
CHUN M. NG |
P.O. BOX 1247 |
SEATTLE, WA 98111-1247 |
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