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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
01/08/2008
Application #:
10519837
Filing Dt:
07/05/2005
Publication #:
Pub Dt:
11/10/2005
Inventors:
Shinsuke Sadamitsu, Nobumitsu Takase, Hiroyuki Takao, Koji Sueoka, Masataka Horai
Title:
HIGH-RESISTANCE SILICON WAFER AND PROCESS FOR PRODUCING THE SAME
Assignment: 1
Reel/Frame:
016746/0483Recorded: 07/05/2005Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/09/2005
Exec Dt:
02/12/2005
Exec Dt:
02/15/2005
Exec Dt:
02/16/2005
Exec Dt:
02/12/2005
Assignee:
2-1, SHIBAURA 1-CHOME, MINATO-KU
TOKYO 105-0023, JAPAN
Correspondent:
OBLON, SPIVAK, MCCLELLAND, MAIER & NEUST
1940 DUKE STREET
ALEXANDRIA, VA 22314
Assignment: 2
Reel/Frame:
019385/0772Recorded: 06/05/2007Pages: 7
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/01/2005
Assignee:
2-1, SHIBAURA 1-CHOME, MINATO-KU
TOKYO 105-8634, JAPAN
Correspondent:
OBLON, SPIVAK, MCCLELLAND, MAIER & NEUST
1940 DUKE STREET
ALEXANDRIA, VA 22314

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