Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/09/2007
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Application #:
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11121703
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Filing Dt:
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05/03/2005
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Publication #:
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Pub Dt:
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11/17/2005
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Inventor:
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David T. Beatson
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Title:
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METHOD OF BUMPING DIE PADS FOR WAFER TESTING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2751 CENTERVILLE ROAD |
| LITTLE FALLS CENTER II |
| WILMINGTON, DELAWARE 19808 |
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| WILLIAM L. SHAFFER |
| TOWNSEND AND TOWNSEND AND CREW LLP |
| TWO EMBARCADERO CENTER |
| EIGHTH FLOOR |
| SAN FRANCISCO, CA 94111-3834 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 2101 BLAIR MILL ROAD |
| WILLOW GROVE, PENNSYLVANIA 19090 |
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| CHRISTOPHER M. SPLETZER, SR. |
| 2101 BLAIR MILL ROAD |
| WILLOW GROVE, PA 19090 |
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