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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
10843946
Filing Dt:
05/12/2004
Publication #:
Pub Dt:
11/17/2005
Inventors:
Mark Lynch, Seyed Hassan Hashemi
Title:
Package design and method for electrically connecting die to package
Assignment: 1
Reel/Frame:
015326/0755Recorded: 05/12/2004Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/07/2004
Exec Dt:
05/07/2004
Assignee:
4000 MACARTHUR BLVD.
NEWPORT BEACH, CALIFORNIA 92660
Correspondent:
WEIDE & MILLER, LTD.
CHAD W. MILLER
7251 WEST LAKE MEAD BLVD., STE. 530
BANK WEST BLDG., 5TH FLOOR
LAS VEGAS, NV 89128
Assignment: 2
Reel/Frame:
015891/0028Recorded: 10/14/2004Pages: 4
Conveyance:
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/17/2004
Assignee:
4000 MACARTHUR BLVD.
OFFICE OF THE GENERAL COUNSEL
NEWPORT BEACH, CALIFORNIA 92660
Correspondent:
MINDSPEED TECHNOLOGIES, INC.
KEITH KIND
4000 MACARTHUR BLVD
MS E09 906
NEWPORT BCH, CA 92660

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