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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
10967009
Filing Dt:
10/15/2004
Publication #:
Pub Dt:
11/17/2005
Inventors:
Shao-Ta Hsu, Kuo-Hsien Cheng, Shwang-Ming Jeng, Hung-Tsai Liu, Wei-Cheng Chu, Yu-Ku Lin et al
Title:
Method and structure for improving adhesion between intermetal dielectric layer and cap layer
Assignment: 1
Reel/Frame:
015415/0325Recorded: 11/30/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/27/2004
Exec Dt:
10/27/2004
Exec Dt:
10/27/2004
Exec Dt:
10/27/2004
Exec Dt:
10/27/2004
Exec Dt:
10/27/2004
Exec Dt:
10/27/2004
Assignee:
NO. 8, LI-HSIN RD. 6
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77, R.O.C.
Correspondent:
SLATER & MATSIL, LLP
STEVEN H. SLATER
17950 PRESTON RD.
SUITE 1000
DALLAS, TX 75252-5793
Assignment: 2
Reel/Frame:
015415/0330Recorded: 11/30/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/27/2004
Exec Dt:
10/27/2004
Exec Dt:
10/27/2004
Exec Dt:
10/27/2004
Exec Dt:
10/27/2004
Exec Dt:
10/27/2004
Exec Dt:
10/27/2004
Assignee:
NO. 8, LI-HSIN RD. 6
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN ROC 300-77
Correspondent:
SLATER & MATSIL, L.L.P.
STEVEN H. SLATER
17950 PRESTON ROAD
SUITE 1000
DALLAS, TEXAS 75252-5793

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