Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/26/2008
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Application #:
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11067597
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Filing Dt:
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02/26/2005
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Publication #:
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Pub Dt:
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11/17/2005
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Inventor:
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Jian Zhang
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Title:
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VOID FREE SOLDER ARRANGEMENT FOR SCREEN PRINTING SEMICONDUCTOR WAFERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 107 AUDUBOR RD. |
| WAKEFIELD, MASSACHUSETTS 01880 |
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| DON HALGREN |
| 35 CENTRAL ST. |
| MANCHESTER, MA 01944 |
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