Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/12/2007
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Application #:
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11122098
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Filing Dt:
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05/05/2005
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Publication #:
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Pub Dt:
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11/24/2005
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Inventors:
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Kiyoshi Oi, Noriyoshi Shimizu, Yasuyoshi Horikawa
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Title:
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METHOD OF MANUFACTURING ELECTRONIC PART PACKAGING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 80, OSHIMADA-MACHI, NAGANO-SHI |
| NAGANO, JAPAN 381-2287 |
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| ARMSTRONG, KRATZ, QUINTOS, HANSON & BROO |
| 1725 K STREET, NW |
| SUITE 1000 |
| WASHINGTON, DC 20006 |
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