Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11132228
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Filing Dt:
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05/19/2005
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Publication #:
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Pub Dt:
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11/24/2005
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Inventor:
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Masayuki Hasegawa
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Title:
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Lead-free solder alloy and preparation thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 223-2 MATSUGOU, TOKOROZAWA-SHI, |
| SAITAMA, JAPAN 359-0027 |
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| JOE MCKINNEY MUNCY |
| BIRCH STEWART KOLASCH, ET AL. |
| 8110 GATEHOUSE RD., SUITE 100 EAST |
| P.O. BOX 747 |
| FALLS CHURCH, VA 22040-0747 |
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